Rapidus Corporation, a leading manufacturer of advanced logic semiconductors, and IBM, a global technology leader, have joined forces in a significant joint development partnership. This collaboration aims to establish mass-production technologies for chipset packages, a crucial step in the evolution of 2nm-generation semiconductors.
Under this agreement, Rapidus will gain access to cutting-edge packaging technology from IBM for high-performance semiconductors. This mutually beneficial collaboration will enable both companies to leverage their strengths and drive further innovation in this space.
This agreement is part of an international collaboration within the framework of the “Development of Chiplet and Package Design and Manufacturing Technology for 2nm-Generation Semiconductors” project being conducted by Japan’s New Energy and Industrial Technology Development Organization (NEDO). It builds on an existing agreement with IBM for the joint development of 2nm node technology.
As part of the agreement, IBM and Rapidus engineers will collaborate at IBM’s North American facilities for R&D and manufacturing of semiconductor packaging for high-performance computer systems.
Rapidus President and CEO Dr. Atsuyoshi Koike commented: “Building on our current joint development agreement for 2nm semiconductor technology, we are extremely pleased to officially announce this partnership with IBM to establish chipset packaging technology. We will make the most of this international collaboration and pursue initiatives that will allow Japan to play an even more important role in the semiconductor packaging supply chain.”
Darío Gil, SVP and Director of Research at IBM, said: “With decades of innovation in advanced packaging, IBM is honored to expand our collaboration with Rapidus to develop state-of-the-art chiplet technology. Through our agreement, we are committed to supporting the development of the most advanced node production processes, design, and packaging, as well as developing new use cases and supporting the semiconductor workforce.”
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