IBM and Honda Motor Co. Ltd. (Honda) signed a Memorandum of Understanding (MOU) outlining their intent to collaborate on the long-term joint research and development of next-generation computing technologies*1.
Through this collaboration, Honda and IBM aim to develop SDVs that boast world-class computing and power-saving performance, potentially revolutionizing the automotive industry.
The collaboration conveys to overcome obstacles relating to processing capability, power consumption, and design complexity for the realization of the software-defined vehicles (SDV) of the future.
The application of intelligence /AI technologies is expected to accelerate widely in 2030 and beyond, creating new opportunities for developing SDVs.
Honda and IBM anticipate that SDVs will dramatically increase semiconductor design complexity, processing performance, and corresponding power consumption compared to conventional mobility products.
It is critical to develop capabilities in the independent research and development of next-generation computing technologies to solve anticipated challenges and realize highly competitive SDVs. Based on this understanding, the two companies began considering long-term joint research and development opportunities.
In particular, the MOU outlines areas of potential joint research of specialized semiconductor technologies such as brain-inspired computing*2 and chiplet technologies, with the aim to dramatically improve processing performance while, simultaneously, decreasing power consumption.
Hardware and software co-optimization is important to ensure high performance and fast time to market. To achieve such benefits and manage design complexity for future SDVs, the two companies also plan to explore open and flexible software solutions.
*1 Computing technology being developed with an aim to achieve both high processing performance and low power consumption in the 2030s and beyond.
*2 Computer architecture and algorithms that mimic the brain’s structure and function while optimizing for silicon.
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