Today, MediaTek Unveiled the Dimensity 8400, introducing the first All Big Core, the most powerful Gen-AI chip in the premium smartphone segment. It is based on the foundation of the flagship Dimensity 9400, providing unparalleled Gen-AI processing capabilities within its class.
The Dimensity 8400, featuring an eight-core Arm Cortex-A725 processor, clocked up to 3.25 GHz, achieving a remarkable 41% uplift in multi-core performance compared to its predecessor, the Dimensity 8300. It also optimized performance control, offering a significant 44% reduction in peak power consumption relative to previous generations.
Coupled with this is a robust NPU designed to enhance Gen-AI workloads, leveraging MediaTek’s new Dimensity Agentic AI Engine (DAE), which transforms conventional AI functionalities into more dynamic agentic applications.
The SoC is equipped with an Arm Mali-G720 GPU, delivering a 24% improvement in peak performance and a 42% boost in power efficiency over the Dimensity 8300.
“MediaTek is redefining premium smartphone experiences with the Dimensity 8400, unleashing creativity with generative and agentic AI applications and taking mobile gaming even further,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business Unit. “Our All Big Core design, which we’ve also integrated into our flagship chips, highlights the impressive performance and efficiency that can go hand-in-hand so consumers don’t have to compromise.”
The GPU integrates with MediaTek Frame Rate Converter (MFRC) and MediaTek Adaptive Gaming Technology (MAGT) 3.0 to optimize real-time gameplay experience and application performance.
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The Dimensity 8400 also supports mainstream LLM/SLM/LMM frameworks, allowing seamless access to advanced Gen-AI applications such as translation, contextual replies, and AI-assisted media generation.
Developers will benefit from the DAE, which anticipates user preferences and adapts AI applications accordingly. On the imaging front, the integrated MediaTek Imagiq 1080 ISP utilizes QPD remosaic technology to improve light capture and focus accuracy, delivering high-resolution images and HDR recording capabilities throughout the zoom range.
Key specifications of the Dimensity 8400 include: A 5G-A modem with up to 3CC-CA support, achieving peak performance of 5.17 Gbps. Network Observation System (NOS) allowing precise 5G/Wi-Fi handovers for enhanced connectivity and power efficiency. WQHD+ supports up to 144Hz and dual-screen compatibility.
Smartphones powered by the MediaTek Dimensity 8400 are expected to hit the market by the end of 2024.