cxo voice
  • Business
  • Technology
    • AI
    • Cloud
    • Telecom
    • Data Center
    • BPM
    • Blockchain
  • Finance
    • Banking
  • Cyber Security
  • View Points
  • Leaders Talk
  • Press Release
    • Submit Press Release
No Result
View All Result
  • Business
  • Technology
    • AI
    • Cloud
    • Telecom
    • Data Center
    • BPM
    • Blockchain
  • Finance
    • Banking
  • Cyber Security
  • View Points
  • Leaders Talk
  • Press Release
    • Submit Press Release
No Result
View All Result
Leaders Talk and Latest Tech News | CXO VOICE
No Result
View All Result
Home News Technology

Samsung Electronics starts Mass Production of the Thinnest LPDDR5X DRAM Packages

News Desk by News Desk
August 6, 2024
A A
Samsung chip

Photo: Samsung-LPDDR5X-DRAM-Package

Samsung Electronics has started mass production of the thinnest 12-gigabyte (GB) and 16GB LPDDR5X DRAM packages using a 12 nanometer (nm)-class technology, solidifying its leadership in the low-power DRAM market.

Leveraging its extensive expertise in chip packaging, Samsung is able to deliver ultra-slim LPDDR5X DRAM packages that can create additional space within mobile devices, facilitating better airflow. This supports easier thermal control, a factor that is becoming increasingly critical, especially for high-performance applications with advanced features such as on-device AI.

“Samsung’s LPDDR5X DRAM sets a new standard for high-performance on-device AI solutions, offering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package,” said  YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics. “We are committed to continuous innovation through close collaboration with our customers, delivering solutions that meet the future needs of the low-power DRAM market.”

With the new LPDDR5X DRAM packages, Samsung offers the industry’s thinnest 12 nm-class LPDDR DRAM in a 4-stack structure( each layer consists of two LPDDR DRAMs) reducing the thickness by approximately 9% and improving heat resistance by about 21.2%, compared to the previous generation product.

By optimizing printed circuit board (PCB) and epoxy molding compound (EMC) techniques, the new LPDDR DRAM package is as thin as a fingernail at 0.65 millimeters (mm), the thinnest among existing LPDDR DRAM of 12GB or above. Samsung’s optimized back-lapping (Grinding the backside of a wafer) process is also used to minimize the package height.

Samsung plans to continue expanding the low-power DRAM market by supplying its 0.65mm LPDDR5X DRAM to mobile processor makers as well as mobile device manufacturers.

ADVERTISEMENT

As demand for high-performance, high-density mobile memory solutions in smaller package sizes continues to grow, the company plans to develop 6-layer 24GB and 8-layer 32GB modules into the thinnest LPDDR DRAM packages for future devices.

Also Read: Samsung Completes Validation of Industry’s Fastest LPDDR5X for Use With MediaTek’s Mobile Platform

News Desk

News Desk

by CXO VOICE team memebrs, [email protected]

Related Posts

Flexible AI Chip
Technology

Flexible AI Chip Survives 40,000 Bends While Running AI for Health Monitoring

January 31, 2026
Wipro Operating Model
Technology

Wipro Unveils AI-Powered Operating Model to Rewire Enterprise Functions

January 29, 2026
AI Poised to Reshape the Workforce: Nvidia CEO Optimistic, Goldman Sachs Warns of Automation Risks
Technology

AI Poised to Reshape the Workforce: Nvidia CEO Optimistic, Goldman Sachs Warns of Automation Risks

January 22, 2026
MediaTek Unveils Dimensity 9500s and Dimensity 8500 to Drive Next Generation Smartphone Performance
Technology

MediaTek Unveils Dimensity 9500s and Dimensity 8500 to Drive Next Generation Smartphone Performance

January 16, 2026
IBM Sovereign Core
Technology

IBM Launches Sovereign Core Platform to Give Enterprises Full Control Over AI and Cloud Operations

January 15, 2026
HDDs storage
Opinion

5 Reasons HDDs Will Continue to Dominate Enterprise Storage in the AI Era

January 13, 2026
MediaTek NRF
Technology

MediaTek Unveils AI-Powered Retail Revolution at NRF 2026

January 12, 2026
AI at CES 2026
Technology

AI Takes Center Stage at CES 2026: Consumer Tech Embraces On-Device Intelligence and Smart Living

January 8, 2026
Load More
ADVERTISEMENT

Latest Updates

India and United States Trade Deal

India and United States Strategic Trade Deal; Tariffs Cut, Market Access Expanded

by Ranjeet Roy
14 hours ago

ABB

ABB Launches Platform to Modernise Industrial Control Systems Without Downtime

by News Desk
15 hours ago

Janata Sahakari Bank

Pune’s Janata Sahakari Bank Selects TCS to Modernize Digital Banking Infrastructure

by News Desk
1 day ago

Union Budget 2026

Company Executives Reactions to Union Budget 2026

by Deepa Sharma
2 days ago

Budget 2026

Key Highlights from Union Budget 2026: Manufacturing and Technology Matters

by Deepa Sharma
2 days ago

Flexible AI Chip

Flexible AI Chip Survives 40,000 Bends While Running AI for Health Monitoring

by CXOVoice Editorial Team
4 days ago

Expert Views

HDDs storage
Opinion

5 Reasons HDDs Will Continue to Dominate Enterprise Storage in the AI Era

January 13, 2026
Cybersecurity predictions 2026
Opinion

Prioritizing Proactive Cybersecurity as a Strategic Advantage: The Top 5 Predictions for India in 2026

December 23, 2025
Home Routers
Cyber Security

The Home Router Crisis of 2026: How India’s Living Rooms Became the New Cyberwar Frontline

December 23, 2025
Storage Engineers
Opinion

5 Future-Ready Skills Every Storage Engineer Should Build in 2026

December 22, 2025
AI Govern
AI

How CIOs and CISOs Can Govern AI Without Slowing the Business

December 22, 2025

Get Latest Update

Subscribe to our mailing list to receives newsletter direct to your inbox!

ADVERTISEMENT

Leaders Interviews

NewgenONE
Interview

Reimagining Enterprise Transformation: Varun Goswami on the Future of NewgenONE and AI-Driven Automation

-
Jagat Shah, Chairman & CEO of MITSUMI Group
Leaders Talk

Leadership in Emerging Markets: Exclusive Interview with Jagat Shah, Chairman & CEO of MITSUMI Distribution

-
Tokenization
Interview

Revolutionizing Finance: An Exclusive Interview with Sid Ugrankar, Co-founder of Qila.io on the Future of Blockchain and Tokenization

-
Steve Wilson, GenAI Cybersecurity LLMs
Cyber Security

How effective is GenAI in cybersecurity? The role of LLMs and AI in security solutions. [Interview with Steve Wilson]

-

Entrepreneur

Persistent Gender Bias Clouds Perceptions of Leadership in Tech: Study Finds

Top Leadership Skills Entrepreneurs Need in the Age of AI

Samsung Electronics appoints its first female president

Inspiring Women Entrepreneurs in India (2022)

CXOVoice.com is a leading online publication for CXOs, entrepreneurs, senior leaders, developers, and industry professionals. We publish informed analysis, news reporting, expert commentary, and expert insights across enterprise technology, digital transformation, cybersecurity, data, AI, sustainability, and governance.

Connect with us

Easy Links

  • Cryptocurrency
  • Event
  • Blockchain
  • Press Release
  • Resources & Downloads
Loading
  • Home
  • About Us
  • Contact Us
  • Advertise
  • Privacy & Policy
  • Editorial Policy
  • Feedback

Copyright © 2025 de Audience - All Right Reserved

Welcome Back!

Login to your account below

Forgotten Password?

Retrieve your password

Please enter your username or email address to reset your password.

Log In

Add New Playlist

Our Spring Sale Has Started

You can see how this popup was set up in our step-by-step guide: https://wppopupmaker.com/guides/auto-opening-announcement-popups/

No Result
View All Result
  • Home
  • News
  • Business
  • Technology
  • Cyber Security
  • Opinion
  • Leaders Talk

Copyright © 2025 de Audience - All Right Reserved