MediaTek today announced the Dimensity 7300 and the Dimensity 7300X, a pair of 4nm chips for high-tech mobile offerings.The Dimensity 7300 chipsets allow multitasking, enhanced photography, gaming, and AI-enhanced computing; additionally, the Dimensity 7300X is designed with flip-style foldable devices in mind, providing support for dual displays.
Both MediaTek Dimensity 7300 chipsets have an octa-core CPU consisting of 4X Arm Cortex-A78 cores operating at up to 2.5GHz paired with 4X Arm Cortex-A55 cores to enhance gaming experiences.
The Dimensity 7300 chipsets also offer upgraded photography with the MediaTek Imagiq 950, featuring a premium-grade 12-bit HDR-ISP with support for a 200MP main camera.
“The MediaTek Dimensity 7300 chips will be important for integrating the latest AI enhancements and connectivity features so consumers can seamlessly stream and game,” said Dr. Yenchi Lee, Deputy General Manager of MediaTek’s Wireless Communications Business. “Furthermore, the Dimensity 7300X enables OEMs to develop innovative new form factors thanks to its dual display support.”
Other key features of the Dimensity 7300 and the Dimensity 7300X include:
- MediaTek 5G UltraSave 3.0+ technology incorporating a complete suite of R16 power saving enhancements, plus MediaTek’s own optimizations that provide between 13-30% greater power efficiency compared to competitor alternatives in common 5G sub-6GHz connectivity scenarios.
- Support for up to 3.27Gb/s 5G downlink via 3CC carrier aggregation, providing faster downlink speeds within urban and suburban environments.
- Tri-band Wi-Fi 6E support for fast and reliable multi-gigabit wireless connectivity.
- Dual 5G SIM support with dual VoNR to give users more choice.
Also Read: Quectel Announces RG255G MediaTek-Based Module to Drive 5G RedCap Preparations
