MediaTek has announced that it is one of the first companies to partner with TSMC to create chip featuring the enhanced N2P process, taping out MediaTek’s flagship system-on-chip (SoC) with volume production expected late next year.
This is a major step in the strong partnership between MediaTek and TSMC, which has been providing efficient and powerful chips for many uses, including mobile devices, computers, cars, and data centers.
TSMC’s 2nm technology is the first to use a new type of transistor nanosheet. The N2P process is the next step in this technology, promising better performance and energy efficiency.
The first chip made with the new N2P process is expected to be ready by late 2026. Compared to the current N3E process, those who use N2P can expect to see up to an 18 percent boost in performance without using more power, around a 36 percent reduction in power usage while maintaining the same speed, and a 1.2 times increase in how much logic can fit into the chip.
“MediaTek’s innovations, supported by TSMC’s 2nm technology, show our leadership in the industry as we keep improving the most advanced semiconductor technologies for various devices,” said Joe Chen, President of MediaTek. “Our long partnership with TSMC has led to amazing improvements for our customers all over the world, providing high performance and energy efficiency from edge devices to cloud services.”
“N2P is a big advancement in TSMC’s nanosheet technology and shows our commitment to meeting our customers’ needs by improving our technologies for energy-efficient computing,” said Dr. Kevin Zhang, Senior Vice President of Business Development at TSMC. “Our ongoing work with MediaTek focuses on enhancing performance and power efficiency for many applications.”
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