MediaTek has officially unveiled chipsets Dimensity 7400, Dimensity 7400 X, and Dimensity 6400, expanding its highly regarded Dimensity lineup designed for high-performance mobile devices. These new systems-on-chip (SoCs) will bridge the gap between MediaTek’s flagship offerings, such as the Dimensity 9400 and 8400, and more mainstream options.
The Dimensity 7400 and 7400X are geared to deliver advanced gaming and AI camera technology to consumers, and the Dimensity 6400 provides fantastic performance and enhanced 5G in an accessible package.
Both Dimensity 7400 chipsets integrate an octa-core CPU with 4X Arm Cortex-A78 cores operating up to 2.6GHz and 4X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G615 MC2 GPU. Built on TSMC’s 4nm process node, the Dimensity 7400 and 7400X run super efficiently, using between 14% to 36% less power when gaming compared to competitive chipsets.
The SoCs feature MediaTek Advanced Gaming Technology (MAGT) 3.0 support for improved graphics performance, AI optimizations that adjust game settings based on the device’s workload, reduced input lag for quicker response, and advanced power savings so users can enjoy longer gaming sessions.
“With our Dimensity 7400 and Dimensity 6400 chipsets, MediaTek is proving once again that it has the capability to bring incredible smartphone experience to more affordable price ranges,” said Dr. Yenchi Lee, General Manager of MediaTek’s Wireless Communications Business. “Whether gaming, using the latest AI applications, or taking photos and videos, users can enjoy the significant performance and impressive energy efficiency that they have come to expect from the Dimensity family.”
Also Read: MediaTek Unveils the Dimensity 8400, powerful Gen-AI Chip for Premium SmartphonesThe newest entry in the Dimensity 6000 series of affordable chipsets enhances the latest 5G connectivity features to make them accessible worldwide. The Dimensity 6400 utilizes an octa-core CPU with 2X Arm Cortex-A76 cores operating up to 2.5GHz and 6X Arm Cortex-A55 cores up to 2.0GHz, plus an Arm Mali-G57 MC2 GPU. Built on TSMC’s 6nm process node, Dimensity 6400 runs super efficiently, using up to 19% less power when gaming compared to competitive chipsets.
The first smartphones powered by the MediaTek Dimensity 7400 and 7400X will be available in Q1 2025; Dimensity 6400 is currently available.
